High Quality Used Equipment PDF
Our latest list of available equipment.
USPS Wafer Sealing Regulations
New postal regulations regarding wafer sealing.
Our latest list of available equipment.
New postal regulations regarding wafer sealing.
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The application heads of series ECXM are electromagnetically-controlled glue heads for rapid dot or line applications at high machine speeds. They work with adhesive pressures up to 25 bar and viscosities up to 2,500 mPas.
The ECXM application heads are intended for the application of dispersion-type adhesives. The heads are actuated electromagnetically, i.e. there is no need for an additional pneumatic hose, which facilitates the entire installation. Thanks to their high switching frequency the heads are particularly suitable for precise applications at high speeds, whereby the maximum glue pressure amounts to 25 bar and the viscosity to 2,500 mPas.
The heads of type ECXM are available in diffferent versions:
The basic module is the same in all versions. This modularity results in lower costs thanks to interchangeability, convenient operation and maintenance as well as simple conversion or removal.